Grinding, Polishing & Lapping Material

Cerium Oxide (CeO2)

Our cerium oxide (as rare-earth oxide) are used for a broad range of polishing work: HDD glass substrates, Optical lenses, mirror and so on. Featuring both superior grind-ability and longer life, this polishing material meets strict demands for surface quality.

CeO2 Dispersant agent

Purified Bentonite that clay mineral consist of flaky crystals Montmorillonite as a main component and will swelling and thickening by aqueous.

Al2O3 Polishing Slurry

The compound-type polishing slurry is developed especially for plastic lenses. This high-purity alumina is uniformly dispersed in a special solution with a pH of about 3.0 to 4.0, which delivers excellent polishing performance and a high-quality finished.

Alumina Polishing Powder

A-is the most widely known abrasive powder, popularly called by the name Arundum. WA is a fused White Alumina abrasive powder. It is a product with a wide variety of uses, and typical of the powders used in precision processing. It is produced by crushing fused alumina into a powder and then sorting the particles into a uniform size. PWA is a high quality alumina type abrasive powder, consisting of a plate-shaped crystal of Al2O3 with a purity of over 99.0%. It has excellent heat resistant properties as well as being chemically inert, and is not corroded by either acid or alkaline. As the particle size distribution of PWA is tightly controlled, it can produce a very fine lapped surface, giving it superlative effectiveness as an abrasive.

Silica Polishing Powder

GC, green silicon carbide, is a very high purity SiC lapping powder. GC is well suited for use as a lapping powder in a wide range of functions, including the precision lapping and dicing of crystal and ferrite, the slicing of Si ingot, and the processing of materials ranging from ultra hard metals and edged tools to soft metals such as brass and other copper alloys. C is a black silicon carbide lapping powder, commonly known as Carborundum. Because of its stable cutting edges and its ideal particle size distribution, it is used for abrasive machining. The unique abrasive character of C makes it possible for superior lapping to be done on a work surface. C is ideal for use as a material of precision lapping polishing clothes and papers, and finishing precision grind-stones

Colloidal Silica Slurry

Colloidal silica slurry developed especially for polishing metals, ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and sapphire. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.

Diamond paste & Diamond polishing slurry

a wide range of standard and special Diamond Products formulated and manufactured in our quality controlled laboratories. Each is a special blend of diamond powder with a specific grading and concentration in a chemical carrier to give the optimum

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